INTEL

Intel Xeon 8353H. Processor family: Intel® Xeon® Platinum, Processor socket: FCLGA4189, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1146.88 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: S8S. Processor package size: 77.5mm x 56.5mm. Maximum internal memory: 1120 GB

Intel Xeon Gold 6338. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon Gold 6342. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon W-3175X. Processor family: Intel® Xeon®, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 512 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Package width: 4.09" (104 mm), Package depth: 5.12" (130 mm), Package height: 1.77" (45 mm). Processor package size: 76mm x 56.5mm

Intel Xeon Gold 6354. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon X7460. Processor family: Intel® Xeon® 7000 Sequence, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm