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6222753
Intel Xeon Gold 6334. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm
$3,248.73
5033222
Intel SSDPED1K750GA01. SSD capacity: 750 GB, SSD form factor: Half-Height/Half-Length (HH/HL), Read speed: 2500 MB/s, Write speed: 2200 MB/s, Component for: Server/workstation
$2,957.98
6383979
Intel Xeon Gold 6336Y. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Package type: Retail box
$2,914.04
5499906
Intel Xeon 6230. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 4S. Package width: 1.69" (43 mm), Package depth: 5.39" (137 mm), Package height: 4.41" (112 mm). Processor package size: 76mm x 56.5mm
$2,785.33
6383976
Intel Xeon Gold 6330. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Package type: Retail box
$2,669.55
2238762
Intel Xeon E7440. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm
$2,568.71