Processors

Intel Xeon Silver 4309Y. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Intel Core i9-13900F. Processor family: Intel® Core™ i9, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.5 GHz, Intel® Thermal Velocity Boost Frequency: 5.6 GHz. Processor package size: 45 x 37.5 mm

Intel Xeon ® ® E-2378G Processor (16M Cache, 2.80 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P750, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 5.1 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB

AMD Ryzen 9 7900X. Processor family: AMD Ryzen™ 9, Processor socket: Socket AM5, Processor lithography: 5 nm. Memory channels: Dual-channel. On-board graphics card model: AMD Radeon Graphics. Market segment: Desktop, Compatible operating systems: Windows 11/10 x64, RHEL, Ubuntu

AMD Opteron Dual-core 8214. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron Dual-Core 2220. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor manufacturer: AMD. L1 cache: 0.128 MB

AMD Opteron Dual-core 8212. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron Dual-core 8212. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

Lenovo Intel Xeon Gold 5220R. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: ThinkSystem SN550

Lenovo Intel Xeon Gold 5220R. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: ThinkSystem SR590/SR650

Lenovo Xeon Intel Gold 5220R. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1.02 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Processor package size: 76.0 x 56.5 mm

AMD Opteron Dual Core 2220. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.128 MB