Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software. Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Products specifications
| Attribute name | Attribute value |
|---|
| Maximum internal memory | 786432 MB |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Tcase | 79 °C |
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.20 GHz |
| Intel® Optane™ Memory Ready | N |
| Product family | Intel Xeon Processors |
| On-board graphics card | N |
| Memory clock speeds supported by processor | 2666 MHz |
| Intel® vPro™ Platform Eligibility | Y |
| Market segment | Desktop |
| Status | Launched |
| Intel Turbo Boost Max Technology 3.0 | N |
| Intel® Speed Shift Technology | Y |
| Memory channels | Hexa-channel |
| Product type | 4 |
| Component for | PC |
| ECC | Y |
| Processor family | Intel® Xeon® Gold |
| Processor model | 6134 |
| Processor boost frequency | 3.70 GHz |
| Processor cache | 25344 KB |
| Processor codename | Skylake |
| Processor package size | 76.0 x 56.5 mm |
| Processor socket | LGA 3647 (Socket P) |
| Scalability | S4S |
| Stepping | H0 |
| Thermal Design Power (TDP) | 130 W |
| Maximum internal memory supported by processor | 768 GB |
| Processor cores | 8 |
| Processor threads | 16 |
| PCI Express slots version | 3.0 |
| Processor cache type | L3 |
| Processor lithography | 14 nm |
| Processor operating modes | 64-bit |
| Conflict-Free processor | Y |
| Processor ARK ID | 120493 |
| Intel TSX-NI | Y |
| Maximum number of PCI Express lanes | 48 |
| Embedded options available | N |
| Enhanced Intel SpeedStep Technology | Y |
| Execute Disable Bit | Y |
| Intel 64 | Y |
| Intel Trusted Execution Technology | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Memory types supported by processor | DDR4-SDRAM |